ecwc11 paper 关键字: ·New nanotechnology for solderable surface finishes ·How location and technology of the end-user influence PCB manufacturing technology decisions ·Laser direct testing (a step forward for the Electrical Test of Semiconductor Packaging) ·Copper activation in PCB fabrication using environmental friendly process and technology ·High performance resins systems for copper clad laminates ·Meeting market & regulatory requirements in an environmental compliance world ·Improved inner layer etching by simultaneous Cupric Regeneration & Copper Recovery ·UV-laser for fast and stress free cutting of flexible circuits ·HDI Semi-Flex PCBs, providing new miniaturization solution alternatives ·Stress of electroless copper deposition – measurement and effects on quality of the deposited layer ·Evaluation of Pb-free BGA solder joint reliability on ni-based surface finishes using solder ball shear m...... ·Liquid photoimageable soldermask for high reliability automotive applications 1  [2]    [3]    [4]    [5]    [6]    [7]    [8]    [9]    [10]    [11]    [12]